Industry News
AI Propels Hollow-core Fiber Industrialization
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Author : JIUZHOU
Update time : 2025-11-14 09:30:50
AI Drives Rapid Evolution of Optical Interconnects, Accelerating Hollow-core Fiber Industrialization
The demand for artificial intelligence computing power is driving the rapid evolution of optical interconnect technology, accelerating the industrialization of hollow-core fiber.
A new research report shows that the demand for artificial intelligence computing power is increasing. This is leading to faster upgrades in optical communication technology. This is also changing the market landscape faster than ever before.
This report covers important topics in global optical communication. It includes operator investments, equipment and component manufacturer trends, and chip manufacturer progress. It also discusses acquisitions, financing, new product technologies, and market data. This information serves as a key reference for industry participants making decisions.
Key points of the report are as follows:
I. Operators Increase Investment in All-Optical Network Construction, FTTR and 50G PON Advance Simultaneously
Operators have recently started a strong effort to buy optical cables and terminals. They are focusing on hollow-core fiber, FTTR, and 50G PON. This shows in a few ways:
One operator started buying FTTR-B terminals for tens of millions of yuan. Several operators began buying hollow-core and outdoor optical cables, costing millions to tens of millions of yuan.
They are promoting 50G PON and 400G transmission together. This builds a 10-gigabit optical network that combines "access + transmission."
II. AI Computing Power Becomes the Core Driving Force, Optical Module Speeds Continue to Leap Forward
The explosive growth of AI applications is the most crucial driving factor for the optical module market. 800G optical modules are now common in the market.
The 1.6T technology is ready for large-scale use. Leading manufacturers are starting to work on 3.2T research and development. The demand for 800G optical modules is expected to reach 45 million units by 2026.
In terms of technology, co-packaged optics and silicon photonics technologies have become the focus of attention. At recent industry exhibitions, several companies showed how CPO works with 800G optical modules. Other companies introduced detachable fiber optic connector solutions. This shows that CPO is moving from an idea to real system integration.
III. Hollow-core optical fiber enters the "operator procurement stage," accelerating industrialization.
Hollow-core optical fiber is poised for a period of "technology-industry" synergy by 2025. The minimum loss in the lab is now 0.05 dB/km. Single-fiber capacity has been updated to 502 Tb/s. Transmission latency is over 30% lower than with traditional optical fibers.
Pilot projects are happening in several provinces. The longest line is 137 kilometers long. It can transmit 1.2T in real-time over one wavelength.
At the market level, several operators have initiated centralized procurement of hollow-core optical fiber, marking HCF's entry into the "operator procurement commercialization stage." A big tech company has announced plans to install 15,000 kilometers of hollow-core optical fiber in 24 months.
This will help connect large AI models. Recently, this technology sector received more than 2.5 billion yuan in funding. This sets a new record in the optical fiber field.
IV. Device and chip manufacturers actively deploy high-speed products.
Several companies' 800G LPO optical modules have passed customer tests. There have been breakthroughs in high-performance monitoring modules. Silicon photonic active optical cables have received basic patents.
In terms of chips, 200G/lane EML drivers are now in mass production and shipping. The 1.6T optical DSP chips were officially released. We also launched 400Gbps EML, ITLA, InP-MZM, and other optical chip products one after another.
V. Market Data: Data Communication Spending Reaches New High, AI Data Centers Become Investment Hotspots
Industry data shows that global spending on data communication hit a new high in the second quarter of 2025. Meanwhile, telecom investment stayed stable.
The AI data center market is expected to reach $78.9 billion by 2032. This shows a growth rate of 24.5% from 2025 to 2032. Hyperscale spending increased by 72% compared to last year. AI infrastructure is the main reason for this growth.
Global semiconductor revenue growth forecast was revised upward to 17.6%, with AI as the core driver.
The demand for artificial intelligence computing power is driving the rapid evolution of optical interconnect technology, accelerating the industrialization of hollow-core fiber.
A new research report shows that the demand for artificial intelligence computing power is increasing. This is leading to faster upgrades in optical communication technology. This is also changing the market landscape faster than ever before.
This report covers important topics in global optical communication. It includes operator investments, equipment and component manufacturer trends, and chip manufacturer progress. It also discusses acquisitions, financing, new product technologies, and market data. This information serves as a key reference for industry participants making decisions.
Key points of the report are as follows:
I. Operators Increase Investment in All-Optical Network Construction, FTTR and 50G PON Advance Simultaneously
Operators have recently started a strong effort to buy optical cables and terminals. They are focusing on hollow-core fiber, FTTR, and 50G PON. This shows in a few ways:
One operator started buying FTTR-B terminals for tens of millions of yuan. Several operators began buying hollow-core and outdoor optical cables, costing millions to tens of millions of yuan.
They are promoting 50G PON and 400G transmission together. This builds a 10-gigabit optical network that combines "access + transmission."
II. AI Computing Power Becomes the Core Driving Force, Optical Module Speeds Continue to Leap Forward
The explosive growth of AI applications is the most crucial driving factor for the optical module market. 800G optical modules are now common in the market.
The 1.6T technology is ready for large-scale use. Leading manufacturers are starting to work on 3.2T research and development. The demand for 800G optical modules is expected to reach 45 million units by 2026.
In terms of technology, co-packaged optics and silicon photonics technologies have become the focus of attention. At recent industry exhibitions, several companies showed how CPO works with 800G optical modules. Other companies introduced detachable fiber optic connector solutions. This shows that CPO is moving from an idea to real system integration.
III. Hollow-core optical fiber enters the "operator procurement stage," accelerating industrialization.
Hollow-core optical fiber is poised for a period of "technology-industry" synergy by 2025. The minimum loss in the lab is now 0.05 dB/km. Single-fiber capacity has been updated to 502 Tb/s. Transmission latency is over 30% lower than with traditional optical fibers.
Pilot projects are happening in several provinces. The longest line is 137 kilometers long. It can transmit 1.2T in real-time over one wavelength.
At the market level, several operators have initiated centralized procurement of hollow-core optical fiber, marking HCF's entry into the "operator procurement commercialization stage." A big tech company has announced plans to install 15,000 kilometers of hollow-core optical fiber in 24 months.
This will help connect large AI models. Recently, this technology sector received more than 2.5 billion yuan in funding. This sets a new record in the optical fiber field.
IV. Device and chip manufacturers actively deploy high-speed products.
Several companies' 800G LPO optical modules have passed customer tests. There have been breakthroughs in high-performance monitoring modules. Silicon photonic active optical cables have received basic patents.
In terms of chips, 200G/lane EML drivers are now in mass production and shipping. The 1.6T optical DSP chips were officially released. We also launched 400Gbps EML, ITLA, InP-MZM, and other optical chip products one after another.
V. Market Data: Data Communication Spending Reaches New High, AI Data Centers Become Investment Hotspots
Industry data shows that global spending on data communication hit a new high in the second quarter of 2025. Meanwhile, telecom investment stayed stable.
The AI data center market is expected to reach $78.9 billion by 2032. This shows a growth rate of 24.5% from 2025 to 2032. Hyperscale spending increased by 72% compared to last year. AI infrastructure is the main reason for this growth.
Global semiconductor revenue growth forecast was revised upward to 17.6%, with AI as the core driver.
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